Tin plating is used extensively on many different types of metals, both ferrous and nonferrous. Tin is A gray-white, soft, and ductile metal that is not easily oxidized in air. Electrodeposited tin has good conductivity and corrosion resistance while enhancing solder ability of substrates that are not otherwise easily soldered to. Tin is generally considered non-toxic and non-carcinogenic and as such its use is generally approved for food contact applications. Tin plating is provided in two general types of deposits: bright tin and matte tin. Both can be obtained from an alkaline or acidic bath andElectrical contact applications such as: bus bars, terminals, and switching components where soldering is Required For substrates alloyed with zinc it is generally recommended to apply A diffusion barrier or nickel or copper to Prevent zinc migration into the tin deposit. Tin deposits can have the potential to form tin “whiskers” on the Surface of the deposit. For applications where tin whiskers could negatively impact the function of the Product, tin-lead plating is used.
both are electrolytically applied. The acidic chemistries are most common today.